NIELIT Ahmedabad Gets Infineon-Supported Centre of Excellence for Semiconductor Backend Manufacturing, Inaugurated by Union Minister Jitin Prasada

Key facts

• The NIELIT–Infineon Centre of Excellence (CoE) on Semiconductor Manufacturing was inaugurated virtually on 16 September 2026 at NIELIT Ahmedabad, Gujarat, by Union Minister of State for Electronics & Information Technology and Commerce & Industry Jitin Prasada.
• The CoE was set up by the National Institute of Electronics and Information Technology (NIELIT) under the Ministry of Electronics and Information Technology (MeitY) in collaboration with Infineon Technologies, in the presence of Infineon CEO Jochen Hanebeck, NIELIT Director General Madan Mohan Tripathi, German Charge d'Affaires Georg Enzweiler and Gujarat State Electronics Mission Director Neha Kumari.
• Infineon Technologies is supporting the CoE with eight units of industry-grade semiconductor backend manufacturing equipment: 2 ASM AD838 Die/Glue Bonders, 2 SHINKAWA UTC1000 Wire Bonders, 2 BESI FICO Moulding Machines and 2 BESI FICO Trim-and-Form Machines.
• The equipment enables learners to practise sequential operations of die bonding, wire bonding, moulding, trimming and lead forming, giving exposure to actual semiconductor backend manufacturing workflows.
• The CoE will cater to diploma holders, engineering students, technicians, working professionals and faculty, and will support short-term and long-term training programmes, laboratory modules, faculty development programmes, training-of-trainers initiatives and industry-oriented curricula in semiconductor packaging and backend manufacturing.
• The NIELIT–Infineon partnership began with the signing of the first understanding on 17 March 2025 in the presence of Jitin Prasada.
• NIELIT Ahmedabad will serve as a model that can be replicated and scaled through NIELIT's national network to build a sustainable, industry-led approach to semiconductor skilling.
• The initiative supports India's expanding semiconductor manufacturing, Assembly, Testing, Marking and Packaging (ATMP) and Outsourced Semiconductor Assembly and Test (OSAT) capabilities, and complements the objectives of the India Semiconductor Mission (ISM).